JIACO Instruments

jiaco instruments mip decapsulation system is a breakthrough innovation: automated atmospheric pressure microwave-induced-plasma (mip) decapsulation utilising o2-only recipes. the system has been proven for cu, pdcu, au, ag bond wires and for advanced package types like 3d, sip, wlcsp, boac; all without process induced damage for reliable failure analysis and quality control. our application range includes: - hast, hts, tmcl stressed cu, pdcu, au, ag wire packages - silver wire packages (new) - wafer level chip scale package (wlcsp) (new) - high tg mold compound (new) - film over wire (fow) (new) - chip on board (new) - electrical overstress (eos) failure sites - surface contamination and corrosion - wedge bonds exposure - 3d stacked-die ic package - gallium arsenide (gaas) and gallium nitride (gan) devices (new) - system in package (sip) (new) - localized decapsulation (new) - sensors with transparent mold compound (new) - bond over active circuit (boac) with exposed copper metallization (new) - redistribution layer (rdl) with pbo and copper metallization (new) other applications under r&d

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